发明名称 INDUKTIONSSPULENANORDNUNG UND HERSTELLUNGSVERFAHREN DERSELBEN
摘要 A high current, low profile inductor (IHLP) includes a conductive coil molded within an inductor body substantially free from ferrite materials and comprising powdered iron materials. The method comprises pressure molding the inductor body substantially free from ferrite materials and comprising a powdered magnetic material within the hollow core of the coil and completely around the coil so that the magnetic material is substantially free from voids therein without shorting out the coil.
申请公布号 AT410776(T) 申请公布日期 2008.10.15
申请号 AT20000916363T 申请日期 2000.03.15
申请人 VISHAY DALE ELECTRONICS, INC. 发明人 SHAFER, TIMOTHY
分类号 H01F27/28;H01F37/00;H01F17/04;H01F27/29;H01F41/04 主分类号 H01F27/28
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