Thick layer sensor system manufacturing method for I-supporting frame of e.g. bridge, involves arranging sensors directly on surface of frame, while layer of paste is applied directly on surface of frame for sensor designing

摘要

The method involves designing sensors (5) with a layer of an electrically conductive paste. The sensors are arranged directly on a surface of an element (1) i.e. I-supporting frame to be monitored, while a layer of the paste is applied directly onto the surface of the element to be monitored for designing of the sensors and is directly baked on the element. The sensors are connected together via a field bus (6), which is formed directly on the surface of the element in a thick film technology, where an oscillating circuit with different resonance frequency is designed in the sensors.