| 摘要 |
<p>PURPOSE:To shorten a process, and to decrease parts by a method wherein an optical conductive band is formed between a light emitting element chip and a light receiving element chip, which are mounted while being opposed to a lead frame, and a light shielding body is shaped. CONSTITUTION:The optical conductive band 14 is formed between the light emitting element chip 12 and the light receiving element chip 13, which are mounted while being opposed to the lead frame 11, and the light shielding body 15 is shaped. For example, the light emitting element chip 12 and the light receiving element chip 13 are mounted and bonded to the lead frame 11, and molded primarily with transparent resin such as epoxy resin and the optical conductive band 14 is formed. The whole is molded secondarily with black epoxy resin, etc., and the light shielding body 15 is shaped. Accordingly, the light detecting semiconductor device can be obtained in the short process and by few parts.</p> |
