| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mounting method capable of producing a high quality semiconductor device, having large bonding strength and being resistant to cracking. SOLUTION: In this semiconductor mounting method, a semiconductor device 1 is bonded to a circuit board 4 by pressing and heating a bump 3 formed on a pad 2 of the semiconductor device 1, in a state where the bump 3 is contact with the electrode 5 on the circuit board 4. A plurality of board side bumps 6 are formed previously at the portions surrounding the tops 10 of the bumps 3 on the electrode 5, and the bumps 3 of the semiconductor device side are pressed onto the plurality of board side bumps 6 and are heated, in a state where the bumps 3 make contact with the bumps 6 to bond the semiconductor device 1 to the circuit board 4. |
