| 摘要 |
A batch type cool down chamber is provided to cool down a number of wafers at once in a short time for semiconductor device manufacture by employing wafers of water cooled type which release heat through release globe. A batch type cool down chamber has: a left side plate(10a) which is perpendicular to the base(30); a right side plate(10b) which is parallel to the left side plate; and a number of laminated slot blades(50) which are set upward and downward in horizontal mode and laminated for each of the left and the right side plate. The face of the right side plate confronts the face of the left side plate while leaving a space. A number of long horizontal grooves are on each of the face of the left and right side plates. The slot blades are inserted in the grooves, and a pair of the slot blades, which confront each other from side to side support both edges of the wafer in order to maintain the wafer on a dead level. A water-cooling pipe is equipped inside the left and right side plates, and a deep-set heat release globe is on the upper side of the slot blade. A number of sensors(40) are located between the slot blades upward and downward on the support side plate(20) in order to sense the presence of the wafer.
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