IN SITU, EX SITU, INLINE PROCESS MONITORING, OPTIMIZATION AND FABRICATION

摘要

A method for monitoring and controlling the processing of semiconductor materials and devices is provided to improve production efficiency with the maximized process condition by measuring at least one electrical property between a plurality of contact pads and/or a substrate while applying the light beam and controlling at least one process step based on the electrical measurements. A method of monitoring and controlling the processing of materials and devices comprises the steps of: providing electrical contact pads on a substrate(101); directing a light beam(130) of a selected wavelength and a selected power onto the substrate; measuring at least one electrical property between a plurality of the contact pads and/or the substrate while applying the light beam; and controlling at least one process step based on the electrical measurements. The light beam is a laser light beam or a non-interference light source.