Inkjet printhead chip with a side-by-side nozzle arrangement layout

摘要

An inkjet printhead chip includes an elongate wafer substrate that incorporates a drive circuitry layer. A plurality of nozzle arrangements is positioned side-by-side on the wafer substrate. Each nozzle arrangement has a generally rectangular layout when viewed in plan with longer sides extending from one longitudinal edge of the wafer substrate to an opposite longitudinal edge. Each nozzle arrangement includes a nozzle chamber structure that defines a nozzle chamber and an ink ejection port and that incorporates an active ink ejection member that is displaceable relative to the substrate to eject ink from the ink ejection port. An actuator arm is connected to the active ink ejection member. The actuator arm includes at least one passive anchor and a passive portion extending from the passive anchor and at least one active anchor and an active portion extending from the active anchor. The, or each active anchor is positioned proximate a shorter side of the nozzle arrangement and the, or each passive anchor is positioned inwardly of the active anchor. Both the active and passive portions interconnect the active ink ejection member and the anchors, with the portions at different distances from the substrate so that thermal expansion of the, or each active portion generates displacement of the arms relative to the substrate.