发明名称 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
摘要 A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to extend off the first semiconductor package.
申请公布号 US7436061(B2) 申请公布日期 2008.10.14
申请号 US20060356280 申请日期 2006.02.15
申请人 SEIKO EPSON CORPORATION 发明人 NAKAYAMA TOSHINORI
分类号 H01L23/04;H01L25/18;H01L23/31;H01L23/48;H01L25/065;H01L25/10;H01L25/11 主分类号 H01L23/04
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