发明名称 |
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
摘要 |
A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to extend off the first semiconductor package.
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申请公布号 |
US7436061(B2) |
申请公布日期 |
2008.10.14 |
申请号 |
US20060356280 |
申请日期 |
2006.02.15 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
NAKAYAMA TOSHINORI |
分类号 |
H01L23/04;H01L25/18;H01L23/31;H01L23/48;H01L25/065;H01L25/10;H01L25/11 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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