发明名称 Hybrid strained orientated substrates and devices
摘要 A semiconductor structure and a method for forming the same. The method includes providing a semiconductor structure which includes (a) substrate, (b) a first semiconductor region on top of the substrate, wherein the first semiconductor region comprises a first semiconductor material and a second semiconductor material, which is different from the first semiconductor material, and wherein the first semiconductor region has a first crystallographic orientation, and (c) a third semiconductor region on top of the substrate which comprises the first and second semiconductor materials and has a second crystallographic orientation. The method further includes forming a second semiconductor region and a fourth semiconductor region on top of the first and the third semiconductor regions respectively. Both second and fourth semiconductor regions comprise the first and second semiconductor materials. The second semiconductor region has the first crystallographic orientation, whereas the fourth semiconductor region has the second crystallographic orientation.
申请公布号 US7436006(B2) 申请公布日期 2008.10.14
申请号 US20060419308 申请日期 2006.05.19
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG KANGGUO;ZHU HUILONG
分类号 H01L31/072;H01L31/109 主分类号 H01L31/072
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