| 摘要 |
A sputtering target and a method for manufacturing the same are provided to improve quality of the sputtering target by preventing impurities from being generated at a boundary of a target pattern. A method for manufacturing a sputtering target(10) comprises the steps of preparing a plurality of target patterns, inserting a bonding sheet(16) between the target patterns, melting the bonding sheet at the temperature above 723K and below the melting point of the target pattern, and cooling the molten bonding sheet. The bonding sheet is bent in a zigzag configuration. The bonding sheet includes at least one selected from the group consisting of silver, copper, an aluminum alloy, nickel, and gold.
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