发明名称 |
Method for controlling thickness uniformity of electroplated layers |
摘要 |
An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assembly including a carrier adapted to carry the substrate for movement during deposition, and a conductive element permitting electrolyte flow therethrough. A mask lies over the conductive element and has openings permitting electrolyte flow. The openings define active regions of the conductive element by which a rate of conductive material deposition onto the surface can be varied. A power source can provide a potential between the anode and the cathode assembly so as to produce the deposition. A deposition process is also disclosed, and uniform electroetching of conductive material on the semiconductor substrate surface can additionally be performed.
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申请公布号 |
US7435323(B2) |
申请公布日期 |
2008.10.14 |
申请号 |
US20040869850 |
申请日期 |
2004.06.18 |
申请人 |
NOVELLUS SYSTEMS, INC. |
发明人 |
BASOL BULENT M.;LINDQUIST PAUL |
分类号 |
C25D5/04;C25D17/00;C25D5/22;C25D7/12;C25D17/10;C25D21/00;C25D21/12;C25F3/16;C25F7/00;H01L21/288;H01L21/768 |
主分类号 |
C25D5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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