| 摘要 |
PURPOSE:To obtain the large strength of junction by joining a porous film consisting of a substance having excellent adhesive property with a substrate to the substrate and joining the metallic electrode onto the film. CONSTITUTION:A circuit element 1 is fixed to the connecting electrode 14 of a substrate 2 through a cathode electrode 3 formed to a main surface and a metallic electrode (an electrode to be connected 13) made of gold such as an anode electrode 4 surrounding the electrode 3. The substrate 2 is composed of an Si plate 6, an insulating film 7 consisting of an SiO2 film coated and shaped at the main surface side of the Si plate 6, a porous film 18 made up of SiO2 formed onto the film 7 and a distributing head 8 shaped onto the film 18. The layer 8 is composed of a Cr layer 10, a gold evaporated layer and a gold plated layer 12, and each layer forms connecting electrodes 14 opposite to the electrodes to be connected such as the electrodes 3, 4 of the element 1. According to this constitution, the film 18 and the film 7 are bonded strongly because they are the same oxide. The adhesive property of the film 18 with the layer 10 is strong because the film 18 has porous structure. Accordingly, exfoliation is not generated among the layer 10, the film 18 and the film 7 even when thermal stress is applied. |
