| 摘要 |
A manufacturing method of conductive paste comprising arranging process (S 20 to S 23 ) of ceramics particles, arranging process (S 10 to S 14 ) of wetted metal particles, forming process (S 30 ) of slurry wherein metal particles and ceramics particles are mixed and dispersion treatment process (S 32 ) by applying collision to the slurry. The arranging process of wetted metal particles comprises, a process (S 12 ) of adding solvent, compatible with organic component in conductive paste and incompatible with water, to undried water washed metal particles, a process (S 18 ) of adding surfactant, a process (S 14 ) of separating water from the metal particles and a process (S 15 ) of adding acetone or the other second solvent.
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