发明名称 |
Booster power management integrated circuit chip with ESD protection between output pads thereof |
摘要 |
A booster power management integrated circuit chip includes first and second output pads, a transistor switch coupled between the first and second output pads and having a gate, and a trigger circuit coupled between the first and second output pads and further coupled to the gate of the transistor switch. The trigger circuit drives the transistor switch to conduct when an instantaneous voltage larger than a trigger voltage level is present between the first and second output pads so as to enable electric current to flow through the transistor switch.
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申请公布号 |
US7436640(B2) |
申请公布日期 |
2008.10.14 |
申请号 |
US20050154175 |
申请日期 |
2005.06.15 |
申请人 |
RICHTEK TECHNOLOGY CORP |
发明人 |
SU HUNG-DER;LIU JING-MENG;KU CHIANG-YUNG |
分类号 |
H02H9/00;H01L23/62;H02M3/155;H03K17/0814;H03K17/082 |
主分类号 |
H02H9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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