| 摘要 |
FIELD: technological processes. ^ SUBSTANCE: glass wafer is used with surface area of more than 30 cm2. Set of coatings is created on wafer surface, at that set of coatings includes at least one dielectric film and at least one metallic layer. Wafer is kept in vacuumised chamber. Atmosphere is maintained that contains gas selected from group that consists of inertial gas, nitrogen, oxygen and their mixtures. Elongated cathode target is sprayed, at that it contains from 1 to 99 wt % of titanium and from 1 to 99 wt % of aluminium for application of titanium- and aluminium-containing protective coating on metallic layer for protection of metallic layer against oxidation or further heating of coated wafer. ^ EFFECT: coating possesses high corrosion resistance; low surface resistance and preset optical properties. ^ 11 cl, 20 dwg, 10 tbl, 8 ex |
