MULTILAYERED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
摘要
<p>This invention provides a multilayered circuit board having a one-side stacked structure. The multilayered circuit board comprises a plurality pairs of a conductive circuit layer and an insulating layer and is free from any core substrate with a through-hole subjected to continuity connection by via connection. The multilayered circuit board is characterized in that the glass transition temperature of the insulating layer is 170°C or above, the coefficient of linear expansion at or below the glass transition temperature is not more than 35 ppm, and the modulus of elasticity is not less than 5 GPa.</p>
申请公布号
WO2008120481(A1)
申请公布日期
2008.10.09
申请号
WO2008JP50524
申请日期
2008.01.17
申请人
SUMITOMO BAKELITE COMPANY LIMITED;MARUYAMA, HIRONORI;NAKAMURA, KENSUKE;MEURA, TORU;HIROSE, HIROSHI