| 摘要 |
<p>Disclosed is a transparent conductive film wherein a hard coat layer is arranged on one side of a transparent film base, an SiOx film having a thickness of 10-300 nm is formed on the hard coat layer by a dry process, and a transparent conductive thin film having a thickness of 20-35 nm is arranged on the other side of the transparent film base. Such a transparent conductive film has good wet heat resistance and excellent durability to pen-based input, and enables to suppress occurrence of cracks during a punching process. In addition, occurrence of swell or curl can be suppressed in such a transparent conductive film even under high temperature, high humidity conditions.</p> |
