CURABLE EPOXY RESIN COMPOSITION

摘要

Curable epoxy resin composition, which comprises: i) at least one diglyci dyl ether of bisphenol A (DGEBA) and at least one diglycidyl ethers of bisph enol F (DGEBF) as epoxy resins, wherein the weight ratio of DGEBA : DGEBF is within the range of about 15:85 to 45:55; ii) an anhydride hardener; iii) a t least one plasticizer; iv) optionally a catalyst, at least one filler mate rial and/or further additives; and wherein the dynamic complex viscosity val ue (.eta.*) of said composition is within the range of 0.1 to 20 Pa. s; a pr ocess for making said composition and electrical articles containing an elec trical insulation system made from said composition.