| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce defects generated in an etching process and a wiring material embedding process, in a region where the transfer of a pattern by a template is not performed. <P>SOLUTION: The pattern forming method comprises processes of: coating a photosensitive resin 2 on a film to be worked on a wafer substrate 1; exposing and developing a part of the photosensitive resin 2 and forming a first pattern with an opening; coating a photocurable material 3 on the film to be worked exposed at the opening of the first pattern; bringing one surface of a translucent template 4, for which a second pattern including prescribed recesses and projections is formed on the one surface into contact with the photocurable material 3; irradiating light from the other surface side of the template 4; and separating the template 4 from the photocurable material 3. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
