| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator and a method of manufacturing the same which is suitable for reduction in size. SOLUTION: The piezoelectric oscillator has a structure that an upper recess 4 provided in a ceramic package 1 is hermetically sealed with a cover 6, in which one end of a crystal oscillation element 2 is supported with the internal bottom surface through electrical connection thereto by the single-sided supporting method. An IC chip 3 is flip-chip bonded to the internal bottom surface of a lower recess 5. The lower recess 5 accommodating the IC chip 3 is sealed with the filling resin 7. Wiring patterns 12, 13 provided at the internal bottom surface of the lower recess 5, and bonding pad conducted to the wiring patterns 12, 13 are set to be thicker (higher) than the other wiring pattern 15 and the bonding pads not conducted to the wiring patterns 12, 13. The wiring patterns 12, 13 have the same thickness. COPYRIGHT: (C)2009,JPO&INPIT |
