FILM ADHESIVENESS EVALUATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a film adhesiveness evaluation method having high reliability.

SOLUTION: This evaluation method of adhesiveness to a substrate, of a film in the covered state with a resin has a film forming process for providing a film on the substrate; a cut line forming process for forming a cut line on the film provided in the film forming process; a resin sealing process for covering the film with the resin after the cut line forming process; and a measuring process for placing a sample acquired in the resin sealing process under a prescribed condition, and measuring an exfoliation degree of the film on which the cut line is formed by using a nondestructive inspection device.

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