| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for assembling a hermetically sealed package that accommodates a MEMS die and a sealed package. SOLUTION: The method includes selectively applying a glass mixture to a dome. The dome 27 is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier 24 containing the MEMS device 18, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width. COPYRIGHT: (C)2009,JPO&INPIT |
