发明名称 DESIGN METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a design method of a semiconductor device using a capacitance simulator, and to provide a manufacturing method of a semiconductor device that uses the same. SOLUTION: The manufacturing method is that of a semiconductor device comprising a semiconductor substrate, an insulator formed on the semiconductor device, and an electrode formed on the insulator. The design method of a semiconductor device involves calculating a capacitance by approximating some region of the semiconductor substrate, the insulator and some region of the electrode formed on the insulator to a conductor and a dielectric according to their electric properties. The manufacturing method of a semiconductor device involves adjusting the insulator and electrode sizes, such that a calculated capacitance becomes an optimum value. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008244297(A) 申请公布日期 2008.10.09
申请号 JP20070084989 申请日期 2007.03.28
申请人 TOSHIBA CORP 发明人 TAKAGI SHIGEYUKI;KINOSHITA SHIGERU;WATANABE HIROSHI;YAEGASHI TOSHITAKE
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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