发明名称 SUBSTRATE FOR PROBE CARD ASSEMBLY AND PROBE CARD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a wiring substrate capable of accurately forming probe pin tip positions when probe pins are mounted on electrodes of a large-scale probe card substrate; and a probe card using the wiring substrate. SOLUTION: The wiring substrate comprises an insulating base 1 having a first face 1a and a second face 1b and an electrode 5 having a first portion 51 which is provided on the first face 1a of the insulating base 1 and equipped with a first side face 51a having a recessed part X and an upper face 51b to which a contact terminal 6 is connected and a second portion 52 which is located closer to the first face 1a of the insulating base 1 than the first portion 51 and smaller in size than the first portion 51. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008241595(A) 申请公布日期 2008.10.09
申请号 JP20070085152 申请日期 2007.03.28
申请人 KYOCERA CORP 发明人 FUJISAKI HIROSHI
分类号 G01R1/073;G01R31/26;H01L21/66 主分类号 G01R1/073
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