ELECTROLYTIC PLATING METHOD, ELECTROLYTIC PLATING DEVICE, AND TRANSPARENT CONDUCTIVE FILM AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroplating method for plating a metal part of a transparent electro-conductive film having an electro-conductive layer formed by at least one kind of metals on a support without causing uneven plating, and to provide an electroplating device using the electroplating method, the transparent conductive film and its manufacturing method. SOLUTION: The electroplating method is used for plating the metal part of the transparent electro-conductive film having the electro-conductive layer formed by at least one kind of metals on the support. In metal parts (a), (b) at two arbitrary locations, when the relation of the respective surface resistance values Ra, Rb per unit area satisfies Ra>Rb, the relation of the respective distances Xa, Xb between the anode and each of the metal parts (a), (b) is Xa