| 摘要 |
PROBLEM TO BE SOLVED: To easily provide exact thickness of a substrate by correcting a thickness measured value of the substrate according to an inclined angle of a rotary shaft of a chuck table in a machining device for grinding and polishing the substrate such as a semiconductor wafer. SOLUTION: This grinding and machining device 10 is provided with a measured value correction means 110 for correcting the thickness measured value of the wafer 1 obtained by performing a measurement by a thickness measuring gage 50. In the thickness measured value correction means 110, a correction value for correcting an error generated between actual thickness of the wafer 1 and the thickness measured value by the inclined angle of the rotary shaft 20a of the chuck table 20 is stored. This thickness measured value correction means 110 measures the exact thickness of the substrate by reading the correction value according to the inclined angle together with the inclined angle when the rotary shaft 20 is inclined and correcting the thickness measured value obtained by performing the measurement by the thickness measuring gage 50. COPYRIGHT: (C)2009,JPO&INPIT
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