发明名称 DOPED SUBSTRATE TO BE HEATED
摘要 <p>The invention proposes a structure (10) intended to be heated comprising a substrate (11 ) for the front face (1 ) deposition of a useful layer intended to receive components for electronics, optics or optoelectronics, the structure (10) furthermore containing doped elements that absorb infrared radiation so as to substantially increase infrared absorption by the structure (10) so that said front face (1) reaches a given temperature when a given infrared power is supplied to the structure (10), characterized in that at least one part of the doped elements have insufficient electrical activity or localization in the structure, such that they cannot disturb the operation of the components. In addition, the invention relates to a method of producing this structure and a method of forming said useful layer in a semiconductor material on the structure.</p>
申请公布号 WO2008120092(A1) 申请公布日期 2008.10.09
申请号 WO2008IB00780 申请日期 2008.03.25
申请人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES;LANGER, ROBERT;LAHRECHE, HACENE 发明人 LANGER, ROBERT;LAHRECHE, HACENE
分类号 H01L21/203;H01L29/34 主分类号 H01L21/203
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