| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold for a carrier plate which evades the bending of the plate occurring in the molding of the carrier plate and is superior in workability and a method for molding the carrier plate. SOLUTION: In the mold for molding the carrier plate, a large number of through passages 4, which are penetrated/formed in the thickness direction of a metal plate body 1 forming the carrier plate, keep passage hole forming pins 12a upright which are inserted through a space forming an elastic wall by packing with an elastic member made of silicone rubber between itself and the inner surface of the through passage 4. PTFE eutectoid electroless nickel plating is applied on at least the passage hole forming pin 12a and the surface of the mold 12 in which the passage hole forming pin 12a is installed. COPYRIGHT: (C)2009,JPO&INPIT |
