发明名称 |
CMP PAD CONDITIONER |
摘要 |
<P>PROBLEM TO BE SOLVED: To always maintain a surface condition of a polishing pad in an optimum condition and prevent lowering of a polishing rate. <P>SOLUTION: Annular grooves 16 are concentrically provided three or more on a one surface of a circular base plate 12 for separating the area of an outer part as viewed from a center 14 of the base plate 12 and the area of an inner part. In diamond abrasive grain groups fixed to surfaces of the respective annular areas separated by the annular grooves 16, that in a more inner annular area is larger in grain size. The abrasive grain group in the more inner annular area may be higher in surface acuteness. All the annular areas may be constructed to exist on a flat reference plane or the more inner annular area may be constructed to exist on a plane receding from the polishing cloth. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008238389(A) |
申请公布日期 |
2008.10.09 |
申请号 |
JP20070086977 |
申请日期 |
2007.03.29 |
申请人 |
MEZOTEKU DIA KK;MURUZEN YUKA SHOJI KK |
发明人 |
FUTAESAKU NORIO;YAMASHITA TETSUJI |
分类号 |
B24B53/12;B24B53/017;B24D3/00;B24D7/14;H01L21/304 |
主分类号 |
B24B53/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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