OPTICAL PROCESSING OF LIGHT-TRANSMITTING CONDUCTIVE FILM

摘要

PURPOSE:To enable parts of a light-transmitting conductive film to be selectively removed in minute patterns without damaging a base provided as a substrate, by irradiating the film with pulses of laser light with a wavelength of not larger than 400nm through a light-transmitting mask. CONSTITUTION:A body in which a film 5 of a non-sublimable metal or an organic resin not transmitting pulses of laser light with a wavelength of not larger than 400nm is selectively provided on synthetic quartz 4 is used as the light- transmitting mask. The mask is placed on the light-transmitting conductive film 2 provided on a glass base 1 and comprising tin oxide or indium oxide as a main constituent, and the film 2 is irradiated with pulses of laser light with a wavelength of not larger than 400nm through the mask. By this, the irradiated parts of the film 2 on the irradiated side 3 are pulverized, followed by ultrasonic cleaning to produce the minute patterns.