| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC mounting structure, electro-optic device, liquid crystal equipment and electronic instrument having improved mechanical strength of packaging part, in which packaging is performed using an anisotropic conductive film, thereby improving structure of terminals for IC packaging. SOLUTION: In an IC packaging region 70 of a substrate 20 constituting liquid crystal equipment, first terminals 91A, 91B, 91C are divided into a plurality of terminals 911A, 912A, 913A, 914A, etc. by a slit 96 consisting of a non-forming part of ITO film which constitutes a wiring pattern 9 and first terminals 91. For this reason, when the first terminals 91 and a first electrode 71 are electrically and mechanically connected by an anisotropic conductive film (adhesive), the resin portion contained in the anisotropic conductive film (adhesive) penetrates into the slit 96 so that an IC 7 for driving is firmly bonded to a second transparent board (a second board) 20. COPYRIGHT: (C)2009,JPO&INPIT |
