| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film type laminating apparatus which can apply a uniform pressure even if the surface of a printed circuit board has irregularities and which gives high productivity because of the short lamination time. SOLUTION: The lamination method using the thin-film type laminating apparatus comprises the vacuum treatment step wherein the outside of a lamination module formed by sandwiching a printed circuit board with an upper and a lower elastic film in the ordinary temperature region is evacuated, the gas is sucked from the inside of the expanded lamination module and then the outside of the lamination module is returned to normal pressure; the transfer step wherein the lamination module is transferred from the ordinary temperature region to the heating region while its inside vacuum is maintained; and the lamination step wherein an upper and a lower pressurizing fluid are injected into the outside of the lamination module in the heating region and uniform pressures are applied to the printed circuit board. COPYRIGHT: (C)2009,JPO&INPIT |
