发明名称 CONDUCTIVE METAL PASTE, AND METHOD OF FORMING METAL FILM
摘要 PROBLEM TO BE SOLVED: To provide a conductive metal paste capable of reducing a manufacturing cost, and of reducing volume resistivity of the conductive metal paste itself. SOLUTION: The conductive metal paste is formed by including, in the conductive metal paste itself, a reducing agent being one of alcohols each having a boiling point of 200°C or lower, and having one or more reducing hydroxyl groups in each molecule. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008243484(A) 申请公布日期 2008.10.09
申请号 JP20070080135 申请日期 2007.03.26
申请人 TOSHIBA CORP 发明人 SATO KATSUHIRO
分类号 H01B1/22;H01B13/00;H05K1/09 主分类号 H01B1/22
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