发明名称 CONTACT MECHANISM DEVICE, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a contact mechanism device without needing to form a depression on an element protecting board, and to provide a method of manufacturing the same. SOLUTION: The device includes an element formation substrate 10 provided with a depression 11 for movable part formation, and protective boards 18 jointed to the front and back surfaces of the element formation substrate 10; and is characterized in that external connection terminals 17 are formed on the element formation substrate 10, an element skeleton 12 is formed in the depression 11; conductive parts 15 and 16 electrically connected to contact parts and the external connection terminals are formed on the element skeleton 12; the element skeleton 12 has a magnetic material 13; and the element skeleton 12 executes switching operation in the depression 11 by applying a magnetic field thereto. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008243450(A) 申请公布日期 2008.10.09
申请号 JP20070079450 申请日期 2007.03.26
申请人 OKI SENSOR DEVICE CORP 发明人 MIYATA TOSHIO
分类号 H01H36/00;H01H11/00 主分类号 H01H36/00
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