发明名称 CIRCUIT FORMING SYSTEM AND METHOD
摘要 A system and method of forming a circuit. The system and method includes layering an impressionable material and a conductive material, defining adjacent charge paths on the conductive material, and shaping the impressionable material to increase a gap between adjacent charge paths.
申请公布号 WO2005015477(A3) 申请公布日期 2008.10.09
申请号 WO2004US25698 申请日期 2004.08.06
申请人 SHAPIRA, SHMUEL 发明人 SHAPIRA, SHMUEL
分类号 H01F7/06;A61F13/15;A61F13/42;B21D17/02;B21D31/02;B29C37/00;B29C65/00;B44C3/08;B44C5/04;H01K3/00;H01K3/22;H01R9/00;H01R12/04;H05K1/00;H05K1/11;H05K1/16;H05K3/00;H05K3/04;H05K3/10;H05K3/22;H05K3/28;H05K3/30;H05K3/38 主分类号 H01F7/06
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