ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

[PROBLEMS] To manufacture an electronic device by suppressing deterioration of a resin substrate and an electronic element to minimum. [MEANS FOR SOLVING PROBLEMS] In an electronic device manufacturing method, barrier layers (2, 2') on a pair of resin substrates (1, 1') are bonded, by having low melting point metal layers (7, 7') for sealing electronic elements (3-5) between the resin substrates (1, 1') whereupon the barrier layers (2, 2') are laminated. Light absorbing layers (6, 6') are arranged between the barrier layers (2, 2') and the low melting point metal layers (7, 7'), respectively, the light absorbing layer (6) is irradiated with a laser beam having a wavelength of 350nm or longer but not longer than 600nm through the resin substrate (1') and the barrier layer (2'), the low melting point metal layers (7, 7') are heated and melted, and the barrier layers (2, 2') are bonded.