| 摘要 |
A probe apparatus is provided to prevent an air line of an air injection nozzle from being damaged by mounting the air line in a lead-in line. A probe apparatus includes a probe chuck(110), a probe card(120), a test head(130), a tester(140), a upper air injection nozzle(150) and a lower air injection nozzle(160). The temperature of the probe chuck is able to be changed. The probe chuck clamps and elevates a wafer(W). The probe card is spaced apart from the probe chuck by a predetermined distance. The probe card has a plurality of needles for applying an electrical signal to a pad part of a chip of a wafer positioned on the probe chuck. The test head is electrically connected to the probe card. The tester is electrically connected to the test head. The upper air injection nozzle is installed in an upper portion of the probe chuck to cool the probe chuck heated according to the progress of a process. The lower air injection nozzle is installed in a lower portion of the probe chuck to cool the probe chuck heated according to the progress of a process.
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