| 摘要 |
A fastening system of a heat sink for a substrate is provided to automatically and smoothly perform the fastening operation of a clip which fixes the heat sink to the substrate where a plurality of semiconductor devices such as an RAM are mounted. A fastening system of a heat sink for a substrate couples a clip to a unit module in order to fix the heat sink to the substrate. The clip is moved to the unit module until the clip is completely fastened to the unit module. The unit module is supported so that an end, positioned in the direction in which the clip is moving, cannot be pushed. A guide member(400) is provided between the clip moving toward the unit module and the unit module, and has an insertion portion being inserted into the moving clip to widen the clip. The guide member operates to separate the insertion portion from the clip so that the clip inserted into the insertion portion can hold the unit module.
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