| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high performance flexible electronic circuit package which can improve a flexible electronic circuit package technique, and be manufactured at relatively low cost by most conventional equipments. <P>SOLUTION: The flexible electronic package 51 comprises a heat sink 53; a flexible circuit 55 provided with a semiconductor chip arranged thereon and electrically connected to the semiconductor chip; and a certain amount of heat shrinkage adhesive 63' fixing the flexible circuit to the heat sink so that the flexible circuit becomes flat. The flexible package is adjusted so as to arrange and electrically connect a print circuit board, and so on. The method for manufacturing the package is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
