| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a replacement gold plating solution with which a gold plating film having satisfactory solder joinability and wire bonding characteristics on a wiring board without the occurrence of corrosion in solder resist and underlying nickel can be formed and bonding characteristics are satisfactory. <P>SOLUTION: The electroless gold plating film contains 0.5 to 5 g/L water soluble sulfurous acid gold compound as gold ions, 5 to 200 g/L sulfurous acid and/or its salt, and 5 to 50 g/L water soluble polyamino-polycarboxylic acid and/or its salt and does not contain ethylenediamine and thallium. <P>COPYRIGHT: (C)2009,JPO&INPIT |
