| 摘要 |
PROBLEM TO BE SOLVED: To prevent the lifting of the lead wire because of a springback phenomenon and prevent deterioration of the soldering strength between the capacitor and the substrate, without causing deteriorating of the productivity of the capacitor. SOLUTION: This chip type capacitor is constituted as a capacitor body wherein capacitor elements is housed in an encapsulating case having a shape of a cylinder with the bottom, with the opening of the encapsulating case being sealed with an opening sealing member, and having a plurality of lead wires led out from the capacitor elements and passing through the opening sealing member, an insulating member mounted on the leading-out side of the lead wires and having a recess for receiving the lead wires at the underside portion thereof; and auxiliary electrodes consisting of an electrically conductive material provided in a region near the recess; and the lead wires are received, bent along the recess and the lead wires are held by part of the auxiliary electrodes, thereby the lifting of the lead wire due to the lifting phenomenon can be eliminated. COPYRIGHT: (C)2009,JPO&INPIT
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