发明名称 Surface treatment apparatus
摘要 A surface treatment apparatus encompasses a gas introducing system configured to introduce a process gas from downstream end of a tubular treatment object; a vacuum evacuating system configured to evacuate the process gas from other end of the treatment object; an excited particle supplying system disposed at upstream side of the treatment object, configured to supply excited particles for inducing initial discharge in a main body of the treatment object; and a first main electrode and a second main electrode disposed oppositely to each other, defining a treating region of the treatment object as a main plasma generating region disposed therebetween, wherein the excited particle supplying system is driven at least until generation of main plasma, and main pulse of duty ratio of 10<SUP>-7 </SUP>to 10 <SUP>-1 </SUP>is applied across the first main electrode and second main electrode, to generate a non-thermal equilibrium plasma flow in the inside of the treatment object, and thereby an inner surface of the treatment object is treated.
申请公布号 US2008245478(A1) 申请公布日期 2008.10.09
申请号 US20080081913 申请日期 2008.04.23
申请人 发明人 HOTTA EIKI;SHIMIZU NAOHIRO;IMANISHI YUICHIRO
分类号 C23F1/00;C23C16/448 主分类号 C23F1/00
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