| 摘要 |
A semiconductor device ( 1,21 ) includes a solid state device ( 2,22 ), a semiconductor chip ( 3 ) that has a functional surface ( 3 a) on which a functional element ( 4 ) is formed and that is bonded on a surface of the solid state device with the functional surface thereof facing the surface of the solid state device and while maintaining a predetermined distance between the functional surface thereof and the surface of the solid state device, an insulating film ( 6 ) that is provided on the surface ( 2 a, 22 a) of the solid state device facing the semiconductor chip and that has an opening ( 6 a) greater in size than the semiconductor chip when the surface of the solid state device facing the semiconductor chip is vertically viewed down in plane, and a sealing layer ( 7 ) that seals a space between the solid state device and the semiconductor chip.
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