| 摘要 |
PURPOSE:To contrive to uphold the reliability of bonding of a tape carrier and a chip by a method wherein a metal foil is performed on the back surface of the insulating film substrate of the tape carrier, and after that, bumps are protrudedly provided by performing a metal plating such as a gold plating on the metal foil. CONSTITUTION:A copper foil 12 is provided on the surface of an insulating film substrate 11 and after photo resists 14 and 15 are coated on the copper foil 12 and the back surface of the substrate 11, an exposure is performed and the part 14a other than the wiring pattern forming parts of the photo resist 14 on the surface side is removed, and at the same time, cut-away parts 15a for pump formation are formed on the photo resist 15 on the back surface. After that, bumps 16 are formed in such a way as to rise on the cut-away parts 15 for bump formation by performing a gold plating on parts of the back surface of the copper foil 12, where are located at the cut-away parts 15. When the chip of an IC, an LSI and so forth is mounted on the tape carrier, a connecting terminal on a chip 20, such as an aluminum pad 21, is bonded to the bump 16. The whole chip 16 is made of gold, and moreover, as the bump 16 is crushed at the time of bonding, is made to slide on the surface of the aluminum pad 21 and breaks partially the aluminum oxide film on the surface of the aluminum pad, the bump 21 made of gold and the aluminum pad 21 are fixed. As a result, a highly reliable bonding of the chip and the tape carrier is realized. |
