发明名称 |
HIGH-RESOLUTION POSITIVE TYPE CHEMICALLY AMPLIFIED RESIST MATERIAL AND RESIST PATTERN FORMING METHOD USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-resolution positive type chemically amplified resist material which contains a matrix resin obtained by a simple production method, enables fine resist pattern formation when applied to a non-photolithography process in which exposure is performed under vacuum, and suppresses dropping of a protective group in exposure. <P>SOLUTION: The positive type chemically amplified resist material contains a poly(4-hydroxystyrene) or its derivative in which part or all of the phenolic hydroxyl groups have been substituted by ketal groups, wherein the poly(4-hydroxystyrene) or its derivative is obtained by a production method including living radical polymerization of a styrenic monomer in the presence of a dithioester compound as a RAFT agent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008241737(A) |
申请公布日期 |
2008.10.09 |
申请号 |
JP20070077640 |
申请日期 |
2007.03.23 |
申请人 |
KRI INC;OPTOELECTRONIC INDUSTRY & TECHNOLOGY DEVELOPMENT ASSOCIATION |
发明人 |
MITSUYAMA MASAHIRO;MATAGI HIROYUKI;SUGIMORI TERUHIKO |
分类号 |
G03F7/039;C08F2/38;C08F12/22;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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