| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate maintenance work for a platen and realize both of peeling capability and corrosion resistance. <P>SOLUTION: In the CMP apparatus 10 which supplies slurry to a grinding pad 13 stuck on the rotated and driven platen 11 (11a) and presses a wafer to the grinding pad 13 to be ground, the platen 11 includes an aluminum alloy body part 17, a nickel layer 18 shielded on a surface of the body part 17, and a peeling adjusting layer 19 formed on the nickel layer 18. The peeling adjusting layer 19 has appropriate peeling capability to the grinding pad 13. Besides, the peeling adjusting layer 19 is formed by fluorine-resin for example, and has both of the peeling capability for the grinding pad 13 and the corrosion resistance to chemicals L such as slurry. <P>COPYRIGHT: (C)2009,JPO&INPIT |
