| 摘要 |
PROBLEM TO BE SOLVED: To provide heat dissipation structure of an electronic component which can reduce damage to a peripheral component or the like caused by heat generated from the electronic component which can be adapted to a large current. SOLUTION: The heat dissipation structure of the electronic component 100 has the electronic component 100 and connectors 130, 131 connected to terminals of the electronic component 100 and provided with heat dissipation fins 140, 141 formed so as to be separated from a peripheral electronic component. The connectors 130, 131 whose backs opposed to the electronic component 100 are formed as flat surfaces and the heat dissipation fins 140, 141 are formed so as to be erected from the flat surfaces. COPYRIGHT: (C)2009,JPO&INPIT
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