摘要 |
A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B): (A): a (meth)acrylic polymer containing an epoxy group, and (B): at least one hardener selected from the group consisting of the following components (b<SUB>1</SUB>) to (b<SUB>4</SUB>) (b<SUB>1</SUB>) a polyvalent carboxylic acid, (b<SUB>2</SUB>) a polyvalent carboxylic anhydride, (b<SUB>3</SUB>) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and (b<SUB>4</SUB>) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2) wherein R<SUP>1 </SUP>to R<SUP>6 </SUP>represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R<SUP>3 </SUP>and R<SUP>4 </SUP>may be bonded to form an alkylene group having 1 to 8 carbon atoms; R<SUP>7 </SUP>represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R<SUP>1 </SUP>to R<SUP>7 </SUP>may be substituted by an ether group and/or carbonyl group; Y<SUP>1 </SUP>and Y<SUP>2 </SUP>represent each independently an oxygen atom, or sulfur atom, is provided.
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