OHMIC ELECTRODE STRUCTURE AND SEMICONDUCTOR ELEMENT

摘要

An ohmic electrode structure is provided with a AuGeNi alloy layer (13) arranged on an n-type GaAs layer; and a laminated body composed of bonded metal layers (15, 17) arranged on the AuGeNi alloy layer (13) and barrier metal layers (16, 18) arranged on the bonded metal layers (15, 17). The laminated body is arranged for two cycles or more. On a GaAs contact layer, especially on an n-type electrode, surface diffusion of Ga in the semiconductor and Ni in the AuGeNi alloy layer required for forming ohmic contact at the n-type electrode can be suppressed. Thus, the low resistance ohmic electrode structure and a semiconductor element having such structure are provided.