| 摘要 |
The present invention provides a method of manufacturing a semiconductor device in which a plurality of wires are connected to the same electrode on a semiconductor chip, the method making it possible to inhibit an increase in electrode area. First, ball bonding is performed to compressively bond a first ball to an electrode on a semiconductor chip to form a first connection portion. Wedge bonding is then performed on an inner lead. Subsequently, ball bonding is performed to compress a second ball against the first connection portion from immediately above to bond the second ball to form a second connection portion. Wedge bonding is then performed on the inner lead. |
